Dynasolve CU-7是一個種在刪去應用的聚酰亞胺相關材料的樹脂膠融掉劑。Dynasolve CU-7關鍵在光纖寬帶,半導體設備芯片封裝等業。Dynasolve CU-7 Cured Polyimide Cleaning Solvent is a formulated solvent used to remove cured polyimide materials.
標簽設計:
Dynasolve CU-7