Devcon Stainless teel Putty(ST) 不銹鋼(gang)修補(bu)劑(DEVCON 10270,DEVCON ST)是一種(zhong)不銹鋼(gang)填(tian)充的環氧修補(bu)劑,可修補(bu)不銹鋼(gang)設備(bei),通過(guo)了NSF安(an)全認證,準入食品加(jia)工行(xing)業。
產品概述:
不銹(xiu)鋼填充的環氧修補劑,可修補不銹(xiu)鋼設(she)備,通過(guo)了(le)NSF安全認證,準(zhun)入食品(pin)加工行業(ye)。
DEVCON STAINLESS STEEL PUTTY (ST)
Description
Stainless steel-filled epoxy putty for patching, repairing and rebuilding stainless steel food processing equipment.
Key Features
Non-rusting
Bonds to ferrous and non-ferrous metals
NSF certified for potable water applications
Acceptable for use in meat and poultry plants
Listed under NSN stock #8030-00-268-7934
Open Time: 5 Minutes
Gap Fill: 0.0625" - .075"
Stock # Size
10270 1 LB
關鍵詞:Devcon Stainless teel Putty(ST),不銹鋼修補劑,DEVCON 10270,DEVCON ST